Capability

Electronic manufacturing lineFrom 01005 chip components to ball grid array (.4mm BGA), CONCISYS is fully equipped to handle the most complex printed circuit board technologies, using state-of-the-art equipment and manufacturing techniques.

  • Surface Mount Technology (SMT) Assembly
  • Through-Hole Assembly
  • Flexible PCB Assembly
  • Rigid-Flexible PCB Assembly
  • System Assembly
  • Cable and Harness
  • Complete Box Build
  • Ultra Fine Pitch Mounting/Remove/Replace
  • BGA Mounting and X-Ray (Micro and Standard)
  • BGA Remove/Re-ball (Micro and Standard)

 

Performance

customised assembly processesBecause we understand that our responsiveness and flexibility to our customer’s needs are extremely important, we develop customised assembly processes to match your specific needs. Our manufacturing resources are working 24 hours a day, 7 days a week to serve you wherever, whenever, and however you need us. When timing is everything, our dedicated resources can help because customer responsiveness is one of our top priorities.

  • Quick Response to RFQ
  • 24/7 Availability Communication
  • Quick Turnaround Services (1 to 5 days)
  • Quick Adapt to Customer’s Schedules and Changes
  • On-site Rework

Flexibility

Combination of Turnkey and ConsignmentCONCISYS is able to meet the full range of production demands from our customers. We offer product development, New Product Introduction (NPI) and production volume capability. CONCISYS has developed innovations specifically for high mix, high velocity electronics manufacturing services. Customized solutions that fit our customer’s needs are the basis for our success. Our customers can choose the level of service that best fits their needs including:

  • Turnkey
  • Consignment
  • Combination of Turnkey and Consignment
  • Build-To-Order and Configure-To-Order